Rick:
I'll try to briefly summarize for you the requirements for tinning component
leads.  Note that since you didn't specify whether the requirement is to the
basic document, or to Revision A, there are two (2) explanations below, first
for Mil-Std-2000 and the second for Mil-Std-2000A.   Basically, with
paraphrasing to achieve a nutshell:
- Mil-Std-2000 has four optional methods for assuring solderability:
1) - Solderability test components within 30 days of receipt (par. 5.4.4.1 for
leads, par. 5.4.4.2 for pwb's).  Tests should be i/a/w various Mil-Stds which
have been superseded by technically equivalent (or superior) IPC Standards
(see J-STD-002 & 003).  Parts that pass incoming inspection solderability test
must be soldered into the product within 120 days.  Parts that fail should be
reworked i/a/w the tinning procedure of par. 4.11.3 (hot solder dip with R or
RMA flux to achieve 100 microinch minimum solder coverage).  (The above is
Method 1 of par. 5.4.4.3.)
2) - Tin all components upon receipt to achieve a minimum 100 microinch of
solder coverage.  Use within 2 years.  (Method 2 of par. 5.4.4.3.)
3) - A nontinned component (e.g. one that originally tested OK by method 1)
but which has been in stock longer than 120 days shall be retested for
Solderability and meet the applicable solderability test requirement.  (Method
3 of par. 5.4.4.3.)
4) - Components (which pass incoming solderability test, or are tinned upon
receipt) can be stored for up to 2 years without additional testing if they
meet the original solderability requirements after being exposed to a minimum
of 8 hours of steam aging and are stored in an environment which over a 2 year
period does not deviate for more than 90 days (cumulative) from specified
environmental conditions (BELIEVE ME, YOU DON'T WANT TO GO HERE).  (Method 4
of par. 5.4.4.3.)
 - Any components which fail the solderability testing shall: be cleaned
(chemically or mechanically) i/a/w par. 4.11.1;  be retinned in a 500 degree F
solder pot (par. 4.3.9.5); the solder pot contamination limits shall be
controlled i/a/w Table V (about the same as Table 5-1 of J-STD-001B).
 - Par. 4.10.2 says flux used for soldering has to be Type R or RMA, but
allows Type RA to be used for tinning sealed components under controlled
conditions.
 - Par. 5.4.17.2 provides two options for tinning gold plated surfaces which
are to be soldered.

Mil-Std-2000A is a little less detailed and says:
- Par. 5.2.1 requires you to have a material control system, including
solderability testing and appropriate component storage, that assures parts
are solderable at the start of soldering operations.
- Par. 5.2.1.1 says to solderability test the parts i/a/w some obsolete Mil-
Specs (see J-STD-002 & 003).
- Par. 5.2.5.1 says your solder pot contamination should not exceed the
limits of Table IV (see Table 5 - 1 of J-STD-001B).
- Par. 5.3.1.3 tells you to double tin parts to be soldered if the thickness
of gold plating exceeds 100 microinches.
- Par. 4.6.2 says to use type R or RMA flux.
- Par. 4.6.3 says use of nonrosin flux is OK for tinning and soldering under
certain controlled conditions.
- Par. 4.6.4 says use of type RA flux can be used for tinning sealed
components when done i/a/w certain controlled conditions.
 Well Rick, that sort of does away with brevity.  Hope the above helps some,
if not contact me direct via e-mail and I'll see if I can answer any other
questions.  Or take Al Cash up on his offer to send the relevant paragraphs.
Jim Moffitt, Moffitt Enterprises Consulting.

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