Mike,
        No question your board is going to be stressed by the
auto-insert process, no matter how well adjusted your cut/clinch is.
Better off to handload your through hole if you can....

Mike McMonagle
PCA Process Supervisor
K*Tec Electronics
(281) 243-5639

> -----Original Message-----
> From: Mike Lang [SMTP:[log in to unmask]]
> Sent: Friday, August 14, 1998 12:29 PM
> To:   [log in to unmask]
> Subject:      [TN] QUESTION: SMT Topside plus Through Hole Insertion
> Stress
>
> I would like to expand my PCB assembly capabilities to
> include top-side SMT plus top-side though hole.  The
> process, as most of you know, is:
>
> Stencil Solder Paste
> Pick and Place SMT
> Reflow
> Autoinsert Through Hole Components
> Wave Solder
>
> Bottom side SMT can also be applied before wave.
>
> MY CONCERN: Stress on the topside SMT components /
> solder joints resulting from the autoinsert process (or any
> other stress).
>
> MY QUESTION: What has been done in this field, what
> information is available, what concerns/work-arounds exists,
> etc?  How is this best brought online?
>
> Thanks,
>
> Mike
>
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