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August 1998

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Subject:
Wire Bonding
From:
"Michael D. Doty" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Aug 1998 17:51:44 -0400
Content-Type:
text/plain
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text/plain (19 lines) 
        I'm going to be doing wire bonding in the near future. This process
     is new to me and I would like to get some info on it. Namely what is
     it,What methods are used and are there any good references about it?

     Mike Doty
     P. E. Hadco TCE

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