TECHNET Archives

August 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Wire Bonding
From:
sahmad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Aug 1998 16:29:43 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines) 
You can start with George Harman's book and the three volume Semiconductor
Packaging Handbook.
Syed.

        -----Original Message-----
        From:   Michael D. Doty [SMTP:[log in to unmask]]
        Sent:   Tuesday, August 04, 1998 3:52 PM
        To:     [log in to unmask]
        Subject:        [TN] Wire Bonding

                I'm going to be doing wire bonding in the near future. This
process
             is new to me and I would like to get some info on it. Namely
what is
             it,What methods are used and are there any good references
about it?

             Mike Doty
             P. E. Hadco TCE

        ################################################################
        TechNet E-Mail Forum provided as a free service by IPC using
LISTSERV 1.8c
        ################################################################
        To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
        To subscribe:   SUBSCRIBE TechNet <your full name>
        To unsubscribe:   SIGNOFF TechNet
        ################################################################
        Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
        For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
        ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2