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August 1998

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Subject:
From:
"Singh, Gurminder" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Singh, Gurminder" <[log in to unmask]>
Date:
Thu, 27 Aug 1998 17:02:21 -0700
Content-Type:
text/plain
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text/plain (36 lines)
I am a graduate student in Materials Engineering.  I am planning to do my
thesis on the shear stress of various compositions of solders used in the
packaging industry.  If anyone can help, I would like to know if there are
any standards that exist for preparing samples, carrying out shear stress
tests and related items.  So far, I am unable to locate any standards.  If
someone can point me in the right direction, that would be really
appreciated.

Thank you for your help.

Gurminder Singh
(408) 875 6200

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