Are there any standards for testing the solder joint
mechanical strength for surface mount gull wing lead?

We are wondering if there are any standards and test
methods for the force required to break the solder joint of
individual fine pitch leads when it appears to be a poor joint
from visual inspection. We would like to confirm a poor joint
through some simple non-destructive test in our receiving
inspection area when receiving assembled PCB's from our
board assembly supplier. In other words, this is finished
product. Our idea was to use a force gauge pushing on the
side of the lead and measuring force to break the joint. But
we don't know what is acceptable without a lot of testing. So,
would this be a valid test of a solder joint, are there
established methods for a test like this, and are there
acceptable ranges of force for different types of SMT
packages?

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