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August 1998

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Subject:
Re: Soldering to Electroless Nickel Plating
From:
Michael Carano <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Aug 1998 07:05:03 -0700
Content-Type:
text/plain
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text/plain (39 lines) 
Louis, Edwin wrote:
>
>        WE have a situation where some electroless nickel plated items
> that
>      come in from a vendor are some times solderable with RMA flux and
>      other times requires an organic acid flux to do the job.
>        Someone told us that the phosphorus content may make the
> difference
>      and someone else suggested that included organics may cause this.
> Any
>      comments or experiences with this.
>
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> ################################################################Edwin,
All of the above suggestions are possibilities.
One other possibility is the tendency for any nickel deposit to passivate
readily, thus making the deposit difficult to solder.
Can you suggest putting a flash deposit of gold down to help?

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