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August 1998

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Subject:
From:
"Cash, Alan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Aug 1998 18:21:52 -0400
Content-Type:
text/plain
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text/plain (136 lines)
Conformal coatings are not encapsulation materials.  See IPC T-50 for
the proper terminology and definitions.  A conformal coating is not an
encapsulate.
what are you looking for?

       Al Cash


> ----------
> From:         Hogue, Pat (AZ76)[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Hogue, Pat (AZ76)
> Sent:         Wednesday, August 12, 1998 6:10 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] The ideal eletronic encapsulation material?
>
> Uralane 5750 (Ciba) and Parylene C (Du Pont) meet most of these
> requirements as conformal coatings.
>
> ----------
> From:  Jan Satterfield [SMTP:[log in to unmask]]
> Sent:  Wednesday, August 12, 1998 2:10 PM
> To:  [log in to unmask]
> Subject:  Re: [TN] The ideal eletronic encapsulation material?
>
> I think everyone would like to know the answer to this one!  If
> anyone
> does, please share the response on TechNet!
>
> >-----Original Message-----
> >From:  Edward Boucher [SMTP:[log in to unmask]]
> >Sent:  Wednesday, August 12, 1998 2:49 PM
> >To:    [log in to unmask]
> >Subject:       [TN] The ideal eletronic encapsulation material?
> >
> >Greetings Technet,
> >
> > Dose anyone know of a encapsulating material for electronics, which
> can
> >meet  the majority of these parameters?  We have been searching for
> about a
> >year and have had little success.
> >
> >The Ideal Encapsulation Material
> >
> >a.  low toxicity
> >b.  low moisture permeability
> >c.  no or very low ionic content
> >d.  low viscosity
> >e.  low linear shrinkage
> >f.  low glass transition temperature (Tg)
> >g.  low Coefficient Of Expansion (CTE)
> >h.  low embedment stress
> >i.  high tensile strength
> >j.  high thermal conductivity
> >k.  void free
> >l.  electrical insulation properties
> >m.  thermal cycling stability
> >n.  high thermal shock resistance
> >o.  wide temperature range -55 to 95 degrees C
> >p.  good chemical and solvent resistance
> >q.  good adhesion
> >r.  low cost
> >s.  ease of processing (application and clean up)
> >t.  no formation of water
> >u.  non-corrosive
> >v.  easily repairable
> >
> >
> >Your help is appreciated...
> >
> >Ed Boucher
> >Engineering R&D Tech.
> >K and M Electronics
> >413-263-6253
> >
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