I recommend that you take a look at the solder paste manufacturers
recommendations for reflow profile. In addition to your rise rate, time
above reflow and peaks you might also need to check soak time and cool down
rate. Any important items that must be checked will be found on the solder
paste data sheet.

I have no knowlede of the datapaq profiler but make sure you are glueing
your thermocouples down, not taping. Also make all thermocouples uniform
(number of twists in the wire and size of glue dot).

Sincerely,

Brian


>Hello Technet:
>
>We need to take a temperature profile for flexible circuits (Flexes). I know
>there is
>a procedure on taking temperature profiles for PCB's.
>My question is there a difference between a PCB thermal profile with a Flex
>thermal profile.
>Are there anymore important criteria to check for besides checking peak
>temperature, time above reflow and ramp rate. I would appreciate it if you
>could help provide this information.
>We are currently using Datapaq's Reflow Tracker to track our profile but
>have not provided accurate thermal profile. Do you
>know whom I can contact? I would appreciate if you could help us. I look
>forward to hearing from you.
>
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