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August 1998

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Subject:
From:
Aric parr <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Aug 1998 07:22:16 EDT
Content-Type:
text/plain
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text/plain (78 lines)
I have wavesoldered wires into circuit boards at several employers. I was
not aware of any reliability issues related to this.

It was preferred that a crimp on solderable lug app. .125 thicker than the
PCB (.060 above and below) was put on the wire prior to soldering. This
kept the wire in the hole and properly oriented during processing and
soldering. They are probably internal preforms available to reflow the
crimp if needed.

The crimped fitting also functioned as a stress relief, in that wire flex
did not occur at the solder joint itself.

Most of these designs are now service only due to high cost and low yield
(wires cross easily). Flat spade lugs, large pins, screw terminals, plug in
wire harnesses...can handle the power with significantly reduced
manufacturing problems.

ARIC PARR
Sr. Manufacturing Engineer
Eaton Corp
1400 S. Livernois
P. O. Box 5020
Rochester Hills, Mi 48308-5020
[log in to unmask]
248 608 7780
Fax: 248 656 2242
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 8/6/98 4:57 PM:
To: Aric Parr@01635@Lectron_RH,
EatonWHQ@CorpMail@WHQCleveOH[C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG]

Hi Steve

Our application is essentially to boost current carrying capacity without
the need to increase the size of the housing (marketing requirement). We
need to provide a high current path from pcb to bulkhead mounted connector.
The wires are insulated and can withstand the ends being tinned and
soldered. ie the insulation type has been appropriately selected. The
length of wire is 4 to 6 inches. Due to the compact nature of the design,
there is no physical height for through-hole slid on terminal points on the
pcb on which to attach wires with a crimped "spade lug". My concerns are
the reliability of the large soldered wire joints to the pcb - during
assembly or servicing will an unacceptable force be applied to the solder
pad. The assembly process if this is acceptable is slow, but acceptable to
production. I am also concerned with the ability of the operator to repeat
the process hundreds of times per day, with the same level of consistency.
As in most engineering solutions we appear to be looking for a compromise,
I want to ensure a reliable one.

Greg

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