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August 1998

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Subject:
Re: solder defect
From:
Matthias Mansfeld <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Matthias Mansfeld" <[log in to unmask]>
Date:
Sat, 29 Aug 1998 22:28:11 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (50 lines) 
On 30 Aug 98 at 4:02, Raymond Lee wrote:

> Dear sir,
>             I'm facing some SMT solder defect problem. The major
>             defect
> I'm facing is solder short(solder bridging). I would like to know
> what are the factors contibute to this defect and solutions to
> overcome this type of problem. I hope to hear from you!

This can have millions of reasons, but first you should be
more specific: which SMT packages, reflow/wave
solder, temperature profile, PCB surface (solder mask), if reflow,
which solder paste (RMA, no clean..), solder paste stencils
(undersized or 1:1 or special shapes) or dispensing........, if wave
solder, orientation of the SMT devices, conveyor speed, solder
temperature.........

Regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://home.t-online.de/home/matthias.mansfeld

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