Hi Gurminder,
I am not so certain, that the information that is out there is all that good,
even if there is lots of it.
I take it, that you are aware, that the shear strength of solders is both
highly temperature- and strain-rate-dependent. Thus, you need to settle on
some representative number of temperature and strain rates to investigate.
While you are at it, I would also suggest you determine the modulus of
elasticity as well as the modulus of plasticity, both of which are also highly
temperature- and strain-rate-dependent. There is no data collection out there
where all three of these proiperties have been measured together and thus in a
coherent fashion.
You must also be aware, that these properties will be different when you
measure them in solder bulk and in actual solder joints, where in many cases
the solder joint is only a coule of grain layers thick.
But things get even more interesting, because these properties will also vary
with grain size.
There may be more than one thesis in all of this.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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