Hi Mark,
What you are proposing to do is not a good idea.
First, there is no such thing as a standard 'solder joint
force/shear/peel/pull test.' Because of the large variety of solder joint
geometric variations, there can not be one from this consideration alone.
Second, the solder joint strength, as determined by a lead shearing test, has
no bearing on the reliability of the solder joint, provided the test does not
reveal inadequate wetting.
Third, the fracture surface of the forced solder joints give typically more
information than do the shear-load histories, because the ONLY really
important finding is whether or not adequate wetting has taken place.
Fourth, the reliability in actual use does to a large extent depend on the
heel fillet and the 'bottom flat' wetting; if the foot length is <3W, than
also on the presence of a toe fillet, because short feet 'rock' during thermal
cycling. Side fillets are less important, unless you have wetting problems.
Fifth, make sure that your definition of a 'poor' solder joint corresponds
with ANSI-J-STD-001.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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