!"#$ (1 Message)
# of rework cycle for SMT gullwing component (5 Messages)
0.5 mm pitch components and soldermask relief (2 Messages)
0.8mm pitch BGA socket (2 Messages)
0402 Resistors & Caps (3 Messages)
6-pin DIP Optocoupler problem... (1 Message)
<No subject> (1 Message)
Acceleration (g) - Free Unit Conversion Software (3 Messages)
Acronym definition (3 Messages)
Acronyms (1 Message)
Additive Trace Repair (1 Message)
Adjusting the alloy composition in the solderpot (19 Messages)
Administrative Message-Old E-mails (1 Message)
Air filtration units... (1 Message)
Airplane PWB (1 Message)
Alternative to FR-4 (3 Messages)
Anita Sargent/Endicott/IBM is out of the office. (3 Messages)
Antw: [TN] exposing intermetallic on BGA pads... (3 Messages)
Antw: [TN] IMC'S - NO LONGER STIRRING THE POT (2 Messages)
Antw: [TN] Solder joints not bonded to copper (2 Messages)
Applying HAL on Electroles Nickel Gold (1 Message)
Aqueous Heater Update (1 Message)
Aqueous Technologies Corrosion Issue (1 Message)
Assembleon PPS Pro Offline Programming? (1 Message)
Assembling T-Lam boards... (4 Messages)
Assembly Inspection/verification. (3 Messages)
ASTM B867 (3 Messages)
Attaching Microwave Components (5 Messages)
Automatic tape and reel machine (1 Message)
AW: [TN] Antw: [TN] exposing intermetallic on BGA pads.. . (3 Messages)
AW: [TN] Antw: [TN] exposing intermetallic on BGA pads... (9 Messages)
AW: [TN] Lead Free Surface finishes (1 Message)
AW: [TN] Rework Procedures for electronic assemblies. (1 Message)
AW: [TN] Through Hole Oscillator Removal (1 Message)
Back-side Device Metallization (1 Message)
Best Cooling method for LNBP10 Series (1 Message)
BGA Alignment (1 Message)
BGA Component Baking - Plastic Body (7 Messages)
BGA corner pad (4 Messages)
BGA Inspection (1 Message)
BGA pads lifting (3 Messages)
BGA PCB mounting material thickness (2 Messages)
BGA Profiling (1 Message)
BGA Rework - Cleaning board pads (REPOST) (2 Messages)
BGA Solder Ball Rework (1 Message)
BGASolder Ball Rework (1 Message)
Blasts from the past?!?? (9 Messages)
Board layout service (1 Message)
Book Review - Coombs "Printed Circuit Handbook" (1 Message)
bottom side heat sink attachment (6 Messages)
Bow & Twist (4 Messages)
Brass/Stainless Stencil Lifetimes???? (2 Messages)
BUS WIRE (4 Messages)
Call for papers ECWC9 (1 Message)
Capacitor 0603 vs 0402 (1 Message)
Capacitor 0603 vs 0402...why not networks and arrays? (2 Messages)
Ceramic BGA's on FR4,any thermal coefficient problems (1 Message)
Ceramic Substrate (2 Messages)
Chloride levels (8 Messages)
Circuit boards in oil (1 Message)
Cleaning No-Clean (3 Messages)
Cleaning paste when mis-aligned. (4 Messages)
Cleaning paste when misaligned. (6 Messages)
Cleanliness evaluation! (1 Message)
Clearance area around holes (3 Messages)
Company, Inc. (2 Messages)
complainer wave guides (3 Messages)
Component Mass / Pad Geometries (2 Messages)
Component Mounting Techniques for Shock and Vibration (2 Messages)
Component skewing (3 Messages)
Conformal Coat Spray Systems (4 Messages)
Connector tilt, acceptable or not? (3 Messages)
consideration the results of any (1 Message)
Contamination Concern after Strip (1 Message)
Cooling Rates (1 Message)
Copper Invar Copper and BGA's (3 Messages)
Copper migration (16 Messages)
Cost effective Standard via size. (1 Message)
Creepage distances for High voltage Circuits (1 Message)
Cu-In-Cu boards (22 Messages)
current carrying capacity of PTH (4 Messages)
D-SUB connector (15 pin size) with 2 power contacts (2 Messages)
DC Chapter Kickoff in NY - Oct 23 (1 Message)
Defintion of "discoloration" on PCB gold fingers (1 Message)
Delamination testing. (2 Messages)
Depaneling Tool for V-groved Boards (3 Messages)
Dewetting (1 Message)
diamond impregnated hard gold (2 Messages)
DIN connector & Hardware & Labor cost... (1 Message)
double side BGAs (1 Message)
double sided BGAs (8 Messages)
double sided BGAs Re-work (2 Messages)
Easy Thursday Question! (1 Message)
EIA 481-2 (2 Messages)
EN45014 (2 Messages)
Encapsulated Ions (2 Messages)
Encapsulation Voids (3 Messages)
Encoder with contamination.Soldering or Supplier process. (1 Message)
End-of-Line SMT inspection ... need 10x magnification ... (1 Message)
ENIG (1 Message)
ENIG v Immersion Ag (10 Messages)
ERROR (1 Message)
ESD flooring ideas. (7 Messages)
ESD mat material... (1 Message)
ESD smocks in high temperature and humidity level (1 Message)
Expiration date for soft gold surface plating (1 Message)
Exposed Copper Reliability Data (2 Messages)
exposing intermetallic on BGA pads... (1 Message)
FAB. Cleaning stainless steel multilayer bonding shims. (1 Message)
FAB: Registration/Microsection Coupons (1 Message)
failing capacitors (13 Messages)
Fallout (2 Messages)
FDA approval (1 Message)
Flex and Soldering (4 Messages)
FLEX CIRCUIT FAILURE (2 Messages)
Flex delamination? (3 Messages)
Flex technology (3 Messages)
Flip Chip flex circuit (1 Message)
Fluxes (1 Message)
FMA Labs in Northeast US (2 Messages)
Gerber specification (5 Messages)
German Inspection Jig/Support (2 Messages)
Give up on Solving the 0.25% problem (1 Message)
Gold/Paste (3 Messages)
Graphics products (2 Messages)
HASL Plating Thickness (9 Messages)
HASL thickness spec (3 Messages)
Header pin (single pin/post) (2 Messages)
Heat of Combustion (4 Messages)
Heinz Mader/NMADEH/CH/Ascom ist außer Haus. (2 Messages)
Heinz Mader/NMADEH/CH/Ascom ist au?er Haus. (3 Messages)
High aspect ratio via qualification (1 Message)
Hole Diameters for ENIG Press-fit (1 Message)
Holtite Socket (2 Messages)
horizontal lines for flex innerlayers- oxide substitution (1 Message)
Hot and cold cycle on BGA's at test and repair... (11 Messages)
IC Storage (5 Messages)
ICD (1 Message)
ICT Test Points (4 Messages)
IMC's (5 Messages)
IMC'S - NO LONGER STIRRING THE POT (5 Messages)
Impedance Discrepency (2 Messages)
In Search of Thick Cu PCB Manufacturer (11 Messages)
In-line process (2 Messages)
Info about IPC email forums (2 Messages)
Innerlayer shorts - predictions vs. reality (4 Messages)
Inspection Criteria (8 Messages)
Inspection Jig/Support (1 Message)
Interesting Coplanarity ? (1 Message)
Internal Damage to Capacitor (3 Messages)
Ionics again. (1 Message)
IPC 600 (5 Messages)
IPC-2226 : Does it Exist? / HDI Resources (4 Messages)
Is the Listserver back up? (1 Message)
Just a few Questions (4 Messages)
Just a question (1 Message)
Just a question... (10 Messages)
Labs in tha Bay Area, that can test FUSE & Inductor specifications. (1 Message)
Land pattern for wave soldering (6 Messages)
Land Patterns (13 Messages)
Landless Vias (5 Messages)
Laser trimming of resistors (6 Messages)
LCC 20-pin 4x4mm (4 Messages)
Lead Free Infos (2 Messages)
Lead Free Surface finishes (13 Messages)
Lead protrusion (3 Messages)
LEADS FOR LEADLESS CHIP CARIERS (9 Messages)
Leaky Capacitors (8 Messages)
LIDC October 23rd Kickoff Meeting. (1 Message)
Line width and space (3 Messages)
loc(k)tite (1 Message)
Long Island, NY area Chapter-IPC Designers Council Kickoff Meeting (1 Message)
Looking for Chicago-area PCB Position (1 Message)
Looking for Industrial X-ray machine (2 Messages)
Looking for Joseph Fjelstad (3 Messages)
Looking for pad layout info for 40 mil BGA (2 Messages)
Looking for reliable test clip for 128 pin QFP (1 Message)
Looking for some help. (2 Messages)
Mark Orlowski/PEMSTAR Inc is out of the office. (1 Message)
Masking For Conformal Coating (3 Messages)
Material specification (1 Message)
Material specification (7781 E-glass) (1 Message)
Micro SMD WLCSP Rework (3 Messages)
Microvia in BGA pad (1 Message)
MIL-P-50884 PAR. A.3.4.7 (1 Message)
Minimum dielectric spacing for 48V trace and GND (1 Message)
Misdirected mail (1 Message)
Misplace component (2 Messages)
Mitsui's BN resin system (6 Messages)
modeling (5 Messages)
Moisture Sensitive Component Handling & Identification (1 Message)
NHB 5300.4 (1C) (1 Message)
Ni / Au plating services (1 Message)
Ni/Au Plating Big Panels (1 Message)
No Mail 2 days (2 Messages)
NTC: Just a thanks about BGA/ X-ray question posted earlier (1 Message)
Off-Topic - coatings for airplane-home (4 Messages)
OT- Virus Warning (1 Message)
Out of office (2 Messages)
padsPCB question (3 Messages)
Palladium solderability problems (6 Messages)
Panelized Boards (4 Messages)
Particulate matter (7 Messages)
PC Board Sanitization (10 Messages)
PCB baking conditions (9 Messages)
PCB Cleaning (3 Messages)
PCB depanelling (4 Messages)
PCB FLAME RATINGS (6 Messages)
PCB layers swapped (17 Messages)
PCB Moisture Absorption (1 Message)
PCMCIA ENCLOSURES (1 Message)
photoplotting service (2 Messages)
pin swaging - soldering still required? (4 Messages)
Plugged vias (1 Message)
Poor wetting on solder joints (7 Messages)
Poor wetting/Cu migration (2 Messages)
press fit pins (9 Messages)
Press-fit hole dimensions (2 Messages)
Printed Circuit Assembly Cleaning (2 Messages)
Process Problem vs Board Problem (2 Messages)
PWB ASSEMBLY BURN-IN TEST (6 Messages)
PWB Plating (1 Message)
PWB Plating--An attempt at answering (2 Messages)
PWB Plating--OMG! (1 Message)
Quad IVC MK2 (7 Messages)
Question for the physics "gurus" (35 Messages)
Question for the software "gurus" out there (13 Messages)
Question regarding ENIG and solder mask (5 Messages)
Question regarding ENIG and solder mask & Another Subject (1 Message)
Racks plating up (3 Messages)
Raw Card Cost Matrix. (5 Messages)
Recommendations for developing a mold (4 Messages)
Recycling PWBs (3 Messages)
Reflow profiling (14 Messages)
Reject Marking (2 Messages)
Rejected posting to [log in to unmask] (1 Message)
reminder : PRODUCTRONICA 2001 - 6-9 November - New Munich Trade Fair Centre (1 Message)
REPOST: Through Hole Oscillator Removal (2 Messages)
Resin recession (1 Message)
Rework (3 Messages)
Rework of 0201 components (1 Message)
Rework Procedures for electronic assemblies. (5 Messages)
Rough Dirllling (1 Message)
SAMTEC surface mount sockets... (2 Messages)
Searching for reflow oven manufacturer or user (1 Message)
Seeking Conformal Coating (Type UR) Removal Process by S olvent Dipping (3 Messages)
Seeking Conformal Coating (Type UR) Removal Process by Solvent Dipping (2 Messages)
Seeking info on cleaning PWAs with soldered BGAs using ultrasonics (2 Messages)
SEHO Wave soldering (1 Message)
SEHO Wavesoldering (2 Messages)
Serialization of PCB's (5 Messages)
Setting up conformal coating process (7 Messages)
Shiny vs. Dull (2 Messages)
Signal integrity question (2 Messages)
Silver vs. Tin vs. ENIG (1 Message)
SMT Component Additions teepee (1 Message)
Smt Low profile connectors (2 Messages)
SMT Pads (1 Message)
SMT part with Backside Ground (8 Messages)
Sn62 vs. Sn63 (5 Messages)
SNEC Meeting (3 Messages)
So long & thanks for all the fish (4 Messages)
Solder analysis results (5 Messages)
Solder analysis results - Stratification (1 Message)
Solder Ball Oxidation in BGA (2 Messages)
solder balls (2 Messages)
Solder columns (2 Messages)
Solder conditions (2 Messages)
Solder Joint Analysis (3 Messages)
Solder Joint Defects (4 Messages)
Solder joints not bonded to copper (4 Messages)
Solder mask opening... (1 Message)
Solder Paste Measurements (4 Messages)
solder paste with 2% silver (2 Messages)
solder, adhesives, prepregs, etc. (1 Message)
Solderability tests (1 Message)
Solving the 0.25% problem (4 Messages)
some process questions-- (1 Message)
Sorry~~ I got a Virus (1 Message)
SPC @ WAVE SOLDER (16 Messages)
Specs (1 Message)
STRIPPING MAGNET WIRE (4 Messages)
Tantalum Caps (10 Messages)
Technet accepting posts again (2 Messages)
Temporary Burn-In Ovens (1 Message)
Text Comparing Editor (3 Messages)
Thanks for the replies (1 Message)
Thanks for the replies! (1 Message)
THE ANSWER!! Rework Procedures for electronic assemblie s. (1 Message)
THE ANSWER!! Rework Procedures for electronic assemblies. (1 Message)
Thermal Relief in Planes (2 Messages)
Thermally Conducting Adhesive (9 Messages)
Thermally conductive adhesive (3 Messages)
THERMOUNT PWB (4 Messages)
Through Hole Oscillator Removal (5 Messages)
tin on iron and solder on iron (17 Messages)
Tin/gold Intermetallic (11 Messages)
Tinning Solder Tips (2 Messages)
To wave or not to wave, that is the question... (3 Messages)
Too Much (good) Information, changing PCs, I can't keep up. (1 Message)
TOOL FOR V-GROOVE (1 Message)
TRI Lawsuit status... (4 Messages)
Trimming Leads.(IPC-A-610) (1 Message)
Trimming Leads... (16 Messages)
TUV: Color coding of wires in the power supply (1 Message)
uBGA Rework (4 Messages)
uBGA Rework...some pictures.. (1 Message)
UL 94V-0 vs 94V-1 (1 Message)
UL ZPMV2 Listings (4 Messages)
Unknown substance on PCB (7 Messages)
unsubscribe (1 Message)
Uralite (1 Message)
Used equipment - request for info (1 Message)
UV and Flex (1 Message)
Vacuum Packaging (3 Messages)
Vapor Phase Soldering material (12 Messages)
Vapour Phase Soldering material (3 Messages)
Vent Hole (1 Message)
VIAS in pads... (5 Messages)
Vibratory base feeders (1 Message)
Wanted: Used TMA (1 Message)
Waste water treatment systems... (1 Message)
Weave Exposure... (3 Messages)
What Causes Dlamination (2 Messages)
White residue from conformal coating (7 Messages)
White residue on cored solder (1 Message)
White Residue... (2 Messages)
Wire Bonding on Rh (1 Message)
X-Ray Laminography Services (2 Messages)
X-Ray Laminography Test (2 Messages)
Zicon Conformal Coat sprayer? (1 Message)
[LF] Eutectic alloys????? (2 Messages)
[TN] Question for the physics "gurus" (2 Messages)