Unless it is a customer requirement to provide thermal profiles for each
lot, I don't understand the necessity to profile so frequently. Generally
speaking, I have always used just a few profiles for everything. These were
defined for different pastes or epoxies. As a new product came to the shop
floor, I would run a sample with the Datapaq to confirm the appropriate
thermal conditions and add that assembly to the list of assemblies used on
that profile.
Regarding the attachment issue, I would suggest the Sanders thermocouples
that clamp onto the edge of the board (Sold by ECD 1-800-323-4528 or Datapaq
508-988-9000) They are very accurate and require no attachment to the
device (solder, glue, tape). I had my set (8", 10", and 12") for several
years and used them for both reflow and wave solder applications, proving
they were quite robust.
Hope this helps,
Rich
Richard Elensky
Sr. Manufacturing Engineer
[log in to unmask] <mailto:[log in to unmask]>
Tel: 559-292-1111 x246
Fax: 559-292-9355
Dantel
2991 North Argyle Ave.
Fresno, CA, 93727
Visit our web site at:
http:// www.dantel.com <http://www.dantel.com>
----------
From: Brad A. Smith [SMTP:[log in to unmask]]
Sent: Thursday, October 25, 2001 8:37 AM
To: [log in to unmask]
Subject: [TN] Reflow profiling
Hello All,
I am with a low volume, frequent changeover contract manufacturer.
We are
trying to implement a system where we profile the first assembly of
every
new run through our reflow oven. We are currently using high
temperature
solder for profiling. If we start to use the high temp solder for
this, we
will have to scrap the assemblies. Does anyone have any suggestions
for
alternatives to high temp solder? Any suggestions would be greatly
appreciated.
Thank you,
Brad Smith
Process Technician
Badger Electronics Co., Inc.
(262)886-8800
[log in to unmask]
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