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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 25 Oct 2001 12:37:42 -0400 |
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Hi Brad,
Why not use a temperature datalogger, kapton tape and some long thermocouple
wire?
There are many sources but http://www.omega.com would be a great place to
start.
Hans
Integrity First - Service Before Self - Excellence in All We Do
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Electronics Engineer
Warner Robins - Air Logistics Center (WR-ALC/LUGE)
Special Operations Forces System Program Office (SOF - SPO)
Gunship Team
226 Cochran Street
Robins AFB GA 31098-1622
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-----Original Message-----
From: Brad A. Smith [mailto:[log in to unmask]]
Sent: Thursday, October 25, 2001 11:37 AM
To: [log in to unmask]
Subject: [TN] Reflow profiling
Hello All,
I am with a low volume, frequent changeover contract manufacturer. We are
trying to implement a system where we profile the first assembly of every
new run through our reflow oven. We are currently using high temperature
solder for profiling. If we start to use the high temp solder for this, we
will have to scrap the assemblies. Does anyone have any suggestions for
alternatives to high temp solder? Any suggestions would be greatly
appreciated.
Thank you,
Brad Smith
Process Technician
Badger Electronics Co., Inc.
(262)886-8800
[log in to unmask]
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