Unless it is a customer requirement to provide thermal profiles for each lot, I don't understand the necessity to profile so frequently. Generally speaking, I have always used just a few profiles for everything. These were defined for different pastes or epoxies. As a new product came to the shop floor, I would run a sample with the Datapaq to confirm the appropriate thermal conditions and add that assembly to the list of assemblies used on that profile. Regarding the attachment issue, I would suggest the Sanders thermocouples that clamp onto the edge of the board (Sold by ECD 1-800-323-4528 or Datapaq 508-988-9000) They are very accurate and require no attachment to the device (solder, glue, tape). I had my set (8", 10", and 12") for several years and used them for both reflow and wave solder applications, proving they were quite robust. Hope this helps, Rich Richard Elensky Sr. Manufacturing Engineer [log in to unmask] <mailto:[log in to unmask]> Tel: 559-292-1111 x246 Fax: 559-292-9355 Dantel 2991 North Argyle Ave. Fresno, CA, 93727 Visit our web site at: http:// www.dantel.com <http://www.dantel.com> ---------- From: Brad A. Smith [SMTP:[log in to unmask]] Sent: Thursday, October 25, 2001 8:37 AM To: [log in to unmask] Subject: [TN] Reflow profiling Hello All, I am with a low volume, frequent changeover contract manufacturer. We are trying to implement a system where we profile the first assembly of every new run through our reflow oven. We are currently using high temperature solder for profiling. If we start to use the high temp solder for this, we will have to scrap the assemblies. Does anyone have any suggestions for alternatives to high temp solder? Any suggestions would be greatly appreciated. Thank you, Brad Smith Process Technician Badger Electronics Co., Inc. (262)886-8800 [log in to unmask] ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------