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October 2001

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Subject:
From:
"Dorothy M. Lush" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Oct 2001 11:03:02 -0700
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Jorge,

I have always heard that the manufacturers of tantalum capacitors recommend
these parts never be exposed to the thermal shock of the solderwave. I also
heard that the low ESR tant's are particularly sensitive to thermal shock.
No one wants these parts to fail in the field. That's bad.

Can these parts be selectively removed from solderwave with a solder
pallet/fixture? Why are these parts on the bottom side and not the top? Have
you asked for that? In my DFMs my rule-of-thumb for SMD clearance around a
PTH lead equals the tallest SMD part height (that might interfere with
fixture design) plus150 mils. So if you have only chip parts the clearance
is 150 mils plus the chip height. (All bets are off if the SMD part is over
350 mils.) Also, can your PTH parts be paste-in-holed so you can skip this
whole issue?

Dorothy Lush
> ----------
> From:         Jorge Rodriguez[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Tuesday, October 02, 2001 10:28 AM
> To:   [log in to unmask]
> Subject:      Tantalum Caps
>
> Technetters,
>
> I have a product that has Tantalum Caps, having them waved would make our
> life easier, the board has some TH components we currently hand solder and
> that could be waved. I know that there might be some reason not to wave
> Tantalums, but I am not sure. Can Tantalum Caps be wave soldered?, Has
> anyone done this?
>
> Any responses would be appreciated
>
> Jorge Rodriguez
> Process Engineer
> Varian Inc
>
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