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October 2001

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Subject:
From:
Mel Parrish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Oct 2001 15:10:07 -0700
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Two original advantages as I recall.
Lower surface tension.
A degree of protection for components that contain nobel metal.

Mel Parrish
Soldering Technology International
Madison, AL
256 705 5530
256 705 5538 Fax
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Alan Kreplick
Sent: Wednesday, October 03, 2001 12:27 PM
To: [log in to unmask]
Subject: [TN] Sn62 vs. Sn63


Hello Technet:

We're currently using a water-soluble Sn62 solder paste, in which the
formulation is five plus years old.  We're beginning a solder paste
evaluation using the current solder paste, a newer formulation from that
manufacturer plus a half dozen other solder pastes from other leading paste
manufacturers.

Many of the paste manufacturers have asked why we're using Sn62, and we're
now asking ourselves the same question, "Why not make the switch to Sn63
during the paste evaluation?".

So, two questions:

   What are the major Pro's & Con's of Sn62 vs. Sn63 (mechanical,
   electrical, processing, etc.)?

   Anybody willing to share their solder paste evaluation/qualification
   (techniques, results, lessons learned, etc.)


As, always, thanks in advance for your responses.


Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
North Reading, MA
Tel: 978-370-1726
Fax: 734-661-5352

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