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October 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Oct 2001 13:45:01 +0800
Content-Type:
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text/plain (138 lines)
Actually, you don't need very long thermocouple wire. Just bond your
t/couples to the desired board positions and plug them into a data logger
that travels through the reflow oven with the board. At the other end, you
unplug the data logger from the t/couples and plug it into a printer with a
special docking port and it just prints out the profile of the temperatures
achieved by each couple on its journey through the oven. Then if you need
to tweak the temperature settings of the zones, you can do so and run the
profile baord through the oven again to verify that everything is OK and
get another print-out straight away - very simple and convenient.

Peter Duncan



                    Hinners Hans M Civ
                    WRALC/LUGE                To:     [log in to unmask]
                    <Hans.Hinners@ROBI        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    NS.AF.MIL>                Aero/ST Group)
                    Sent by: TechNet          Subject:     Re: [TN] Reflow profiling
                    <[log in to unmask]>


                    10/26/01 12:37 AM
                    Please respond to
                    "TechNet E-Mail
                    Forum."






Hi Brad,

Why not use a temperature datalogger, kapton tape and some long
thermocouple
wire?

There are many sources but http://www.omega.com would be a great place to
start.

Hans

Integrity First  -  Service Before Self  -  Excellence in All We Do
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Electronics Engineer
Warner Robins - Air Logistics Center (WR-ALC/LUGE)
Special Operations Forces System Program Office (SOF - SPO)
Gunship Team
226 Cochran Street
Robins AFB GA 31098-1622

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Com: (478) 926 - 5224
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-----Original Message-----
From: Brad A. Smith [mailto:[log in to unmask]]
Sent: Thursday, October 25, 2001 11:37 AM
To: [log in to unmask]
Subject: [TN] Reflow profiling


Hello All,

I am with a low volume, frequent changeover contract manufacturer. We are
trying to implement a system where we profile the first assembly of every
new run through our reflow oven. We are currently using high temperature
solder for profiling. If we start to use the high temp solder for this, we
will have to scrap the assemblies. Does anyone have any suggestions for
alternatives to high temp solder? Any suggestions would be greatly
appreciated.

Thank you,
Brad Smith
Process Technician
Badger Electronics Co., Inc.
(262)886-8800
[log in to unmask]

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