I still live in the glass plate and matrix world. Simple correlations
between variables as conveyor speed, temps, topside measurements, managing
fluxes and their applications, wave height, contact area parallelism and
dwell time all make solder joint attributes clearly acceptable or not. SPC
is used in a number of the variables and provides, again, correlation to the
matrix (relative to PCB thermal mass, as an example) and the effects of good
process management. Though wave soldering has a few more factors, compared
with hand or reflow soldering, the basics are all the same, to me, for each.
I'm a simple fool and can't change at this point when it works.

MoonMan

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