To Everyone,
As I get more involved with high density, Rf products and as the worldwide
directive ahs us leaning more to lead-free processes is bearing down on us
all we will be experiencing the need/joy/requirement to be profiling more
often. This is because there are key components being made and designed into
circuits that will require extraordinary temperature control. For example
some are saying that the top of the part must be within 10 degrees celsius
of the bottom (the plane that meets the PCB) of the component AND the reflow
temperature is for high temperature solder irrespective of the fact there
are (many) other components on the assembly that are at the very least
"sensitive" to high temperature solder.
Earl I too feel that most assemblies can be accomodated by a few profiles
but we really can't say what is going on at specific locations and that is
what we will be needing to do to accomodate one "special" part. I need
profiling but I hate it because the equipment cannot do what I need with the
accuracy, dependability and flexability the new design/assemblies require.
Regards,
Dorothy Lush
> ----------
> From: Earl Moon[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.
> Sent: Thursday, October 25, 2001 8:20 AM
> To: [log in to unmask]
> Subject: Re: Reflow profiling
>
> I don't get all your doing or, for that matter, all anyone else is doing.
> At
> HP, a few years ago, we averaged 15 change overs a day on 10 lines with
> seldom more than 50 assemblies each lot/run. To put this in perspective,
> we
> had 1,500 active part numbers going through the shop with requirements for
> nearly 20 million placements/month with every type component imaginable at
> the time. We had only three reflow profiles, with two pastes, and they did
> the job but for exceptions as experiments.
>
> Doubt this answers your question but it is a trip down memory lane for me.
> Sure enjoyed the experience and the trip.
>
> Enjoy,
>
> MoonMan
>
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> Hello All,
>
> I am with a low volume, frequent changeover contract manufacturer. We are
> trying to implement a system where we profile the first assembly of every
> new run through our reflow oven. We are currently using high temperature
> solder for profiling. If we start to use the high temp solder for this, we
> will have to scrap the assemblies. Does anyone have any suggestions for
> alternatives to high temp solder? Any suggestions would be greatly
> appreciated.
>
> Thank you,
> Brad Smith
> Process Technician
> Badger Electronics Co., Inc.
> (262)886-8800
> [log in to unmask]
>
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> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
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