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Reply To: | TechNet E-Mail Forum. |
Date: | Sat, 6 Oct 2001 19:10:08 EDT |
Content-Type: | text/plain |
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Hi Earl,
I sure do not see it the same way--"My concerns start with HASL as a wasted,
mostly
detrimental process as a major contributor to IMC growth". I have yet to see
a solder joint fail because of 'IMC growth,' with the possible exception of
assemblies that were forgotten in the reflow oven over lunch. I much prefer
to see thick IMC layers than inadequately wetted soldering pads, and with
HASL, as they say: "Nothing solders to solder like solder."
Werner Engelmaier
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