Thank you Steve!  Looks like we may be on the right track, hopefully
we can get a couple more suggestions for the technetters.




Hi Sherry,

I've posted the footprint of your uBGA up on my web page, I took the
image and made a *.jpg out of it instead of a *.pdf...I called the
image microBGA footprint.

Go to: http://www.stevezeva.homestead.com/

I had something similar to your problem a couple of years ago...except in my
situation there was a trace running between the two pads. So I had to
dig a little
"tunnel" beneath the trace, and connected the two pads with a piece of trace
material. This was on a uBGA as well...

Good Luck!!

-Steve Gregory-



>Steve,
>
>Hope you can help us.  I don't think technet will allow attachments,
>I know I can't receive them.
>
>I attached a pdf file of the package outline data sheet for a uBGA we
>attached to a FR4 pcb.  Everything worked wonderfully through our
>reflow process. Then the designer found an error in the board layout.
>E3 should have been tied to E4 (active) but wasn't, it is a dead pad
>under the component.   In order to get a temporary fix, the best
>solution that we can think of is to remove the part, remove the mask
>between the two pads on the board and apply conductive epoxy.
>Purchase a micro mini-stencil (5 mil) for paste application and
>reflow/attach a new component.
>
>Still in the learning stage and would welcome suggestions, there
>hasn't been much BGA use here on-site until recently.
>
>Thank you,
>Sherry

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