Dr Bev,
Not sure what your question is but for discussion.  Many of the common
component lead frames contain significant amounts of iron which is plated to
enhance solderability, limit corrosion, etc..  Seems that there should be
some metallurgists out there that can lead us to understanding the
solubility characteristics but my text books discuss FeSn intermetalics
although the rate is slower that that of tin gold or tin copper.  Also seems
to me that the Nickel content is important to the solder interface.

Mel Parrish
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
Sent: Friday, October 19, 2001 2:01 PM
To: [log in to unmask]
Subject: [TN] tin on iron and solder on iron


OK, here is a general question for all you met guys.  But I am not sure I
can explain it well enough to be understood!

We all know that tin can be put on iron or we wouldn't have "tin" cans.  I
also know it is difficult to put solder on iron.  So my question is this: if
one has a tinned iron surface and it is put into molten solder the tin will
be dissolved into the molten solder.  I presume when the piece of iron is
withdrawn from the pot, solder will be well adhered to the iron.  Is this
because there is a solderable tin/iron intermetallic?  What is the main
difference between the tin can process and putting solder directly on iron
that makes one easy to do and the other difficult?  This may be a "first
grade" met question, but I don't know the answer.  Thanks.

Bev Christian

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