Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 22 Oct 2001 15:27:31 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
>From: "Louis, Edwin @ CSE" <[log in to unmask]>
>Subject: Thermally Conducting Adhesive
>What is a good thermally conducting adhesive for placement unter a metal
>quad flat pack device?
Edwin,
I'm not sure if they make one specifically for a QFP (though I bet
they do) but Bergquist makes a product called a SILPAD, which is a dry
thermal transfer agent. This is a MUCH easier product to keep process
control
of, than paste type thermal transfer agents.
I'd recommend you look into their stuff, or a similar dry product.
Best
John Brewer
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|