Hi Mike,
If you also get "ripping the pad off the board" besides ENIG interfacial
failures, you have a component that is not thermally symmetric--that is it
warps on temperature changes. Of course, ENIG is not the most optimum of
metallizations either.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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