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October 2001

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Subject:
From:
Andre Leclair <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Oct 2001 08:09:02 -0500
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Sasha

I like your idea about the wave solder but unfortunatly it wont work with
this application.  The are MICRO BGAs on both sides of the board.  The
backside ground part is on the top side ( with MINi leds) and there are
unsealed mini pots on the bottom.
What we did find was a discrepancy in the customers gerbers.  The paste
layer was too small for the amount of pad.  We are going to attempt a
modification of the stencil by opening up 2 narrow slots radiating out from
the existing appature.

Thanks for all the ideas

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