TECHNET Archives

October 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 22 Oct 2001 14:50:36 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (141 lines)
It must be flux strength. I have watched little old ladies solder wires to
nails. They were using zinc chloride. Destroyed the solder iron tips but did
what they wanted.

We also made some custom tips for Pace solder pens. They were stainless, we
solder plated them too. They did not last as long nor work as good as the
store bought ones but they were less expensive. We did not measure the tip
temperature offset . . . oh yeah you were only asking about soldering iron .
. . ramble on.



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
> Sent: Monday, October 22, 2001 2:34 PM
> To: [log in to unmask]
> Subject: Re: [TN] tin on iron and solder on iron
>
>
> OK, let me try saying this a different way:
> it "seems" that the canning industry has an easy time putting tin on can
> steel.  Why do I have trouble getting solder to stick to a properly
> preheated 100% iron surface?  Is it just a matter of flux strength?  Or
> something else?
>
> Bev Christian
> Research in Motion
>
> -----Original Message-----
> From: Mel Parrish [mailto:[log in to unmask]]
> Sent: October 22, 2001 4:17 PM
> To: [log in to unmask]
> Subject: Re: [TN] tin on iron and solder on iron
>
>
> Dr Bev,
> Not sure what your question is but for discussion.  Many of the common
> component lead frames contain significant amounts of iron which
> is plated to
> enhance solderability, limit corrosion, etc..  Seems that there should be
> some metallurgists out there that can lead us to understanding the
> solubility characteristics but my text books discuss FeSn intermetalics
> although the rate is slower that that of tin gold or tin copper.
> Also seems
> to me that the Nickel content is important to the solder interface.
>
> Mel Parrish
> Soldering Technology International
> 102 Tribble Drive
> Madison, AL 35758
> 256 705 5530
> 256 705 5538 Fax
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
> Sent: Friday, October 19, 2001 2:01 PM
> To: [log in to unmask]
> Subject: [TN] tin on iron and solder on iron
>
>
> OK, here is a general question for all you met guys.  But I am not sure I
> can explain it well enough to be understood!
>
> We all know that tin can be put on iron or we wouldn't have "tin" cans.  I
> also know it is difficult to put solder on iron.  So my question
> is this: if
> one has a tinned iron surface and it is put into molten solder
> the tin will
> be dissolved into the molten solder.  I presume when the piece of iron is
> withdrawn from the pot, solder will be well adhered to the iron.  Is this
> because there is a solderable tin/iron intermetallic?  What is the main
> difference between the tin can process and putting solder directly on iron
> that makes one easy to do and the other difficult?  This may be a "first
> grade" met question, but I don't know the answer.  Thanks.
>
> Bev Christian
>
> ------------------------------------------------------------------
> ----------
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ------------------------------------------------------------------
> ----------
> -----
>
> ------------------------------------------------------------------
> ----------
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ------------------------------------------------------------------
> ----------
> -----
>
> ------------------------------------------------------------------
> ---------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following
> message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources &
> Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ------------------------------------------------------------------
> ---------------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2