OK, the last one was fun. Let's see what I can "provoke" this time!
There are standards for gold thickness for ENIG, "rules" for the amount of
gold in tin/lead solder joints (~4% for tensile, ~2% for shear), but I have
not found, looking into the TechNet archives or in J. Hwang's or Rahn's or
Manko's books I don't have the Wassink et al book ;( ), what is the range
of acceptable/expected intermetallic thickness for tin/nickel intermetallic.
I would appreciate your input - any references and results seen in your own
work. Let the discussion begin.
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: October 24, 2001 6:21 AM
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] exposing intermetallic on BGA pads...
Guenter,
I cannot believe how much I am learning every minute about soldering and all
comprising it. Not at all being negative or contrary, I must have ruined
thousands of solder joints in my long life in this business notwithstanding
all the rework I've done and taught others.
All I've ever been taught, done, and taught others is to remove the solder,
with whatever means that works without damaging pads or board materials,
then print paste, place components, and reflow.
I've never even heard of leaving on solder or removing intermetallics -
especially with a glass brush. I finished my last contract, seemingly
successfully, two months ago. Can the world and all its "wonderful"
soldering technology all of a sudden be passing me by in such a short time?
Jeez, a glass brush. Thanks again Guenter, but I must need more help than
even you, Bob Willis, or all other experts can give.
Earl
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