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October 2001

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Subject:
From:
"Whittaker, Dewey E. (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 15 Oct 2001 09:07:51 -0700
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text/plain
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text/plain (53 lines)
James,
Beware of moisture absorption,Z axis expansion,pad adhesion and signal
integrity issues,if you are dealing with controlled impedance at below 0
temperatures.
Dewey

> -----Original Message-----
> From: Marsico, James [SMTP:[log in to unmask]]
> Sent: Monday, October 15, 2001 7:46 AM
> To:   [log in to unmask]
> Subject:      [TN] THERMOUNT PWB
>
> Dear Technet:
>
> It looks like we're designing a double-sided surface mount multilayer
> board
> using Thermount material, instead of CIC.  Are there any assembly issues I
> should know about?
>
> Thanks in advance,
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
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