Though MIL-STD-883E primarily is used for semiconductor and hybrid component
testing, using test method 2030 might lend more credence to your thermal
issues. This method uses acoustic microspocy (C-SAM) to determine voiding
under chips using various mounting materials - mostly eutectic alloys.

Once voiding determined, using this method or others as x-ray or?,
traditional thermal effeciency analysis can be used rather than depending on
visuals as material "oozing" out from under the devices. When thermal
efficiency and effectiveness is proven acceptable, include the customer and
you'll all be right.

MoonMan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------