Sherry,
I can offer a few additional options. Believe we'll be reviewing these
procedures next week at the IPC Repairability Committee meeting in Orlando
FL. They're a bit exotic, but might help.
Jumper Wires, BGA Components, Circuit Track Method
http://www.circuittechctr.com/guides/6-2-1.htm
Jumper Wires, BGA Components, Through Board Method
http://www.circuittechctr.com/guides/6-2-2.htm
Jeff Ferry
CEO
Circuit Technology Center, Inc
www.circuittechctr.com
[log in to unmask]
978-374-5000
Chairman
IPC Repairability Committee
-----Original Message-----
From: Sherry Warner [mailto:[log in to unmask]]
Sent: Thursday, October 04, 2001 10:23 AM
To: [log in to unmask]
Subject: [TN] uBGA Rework
Thank you Steve! Looks like we may be on the right track, hopefully
we can get a couple more suggestions for the technetters.
Hi Sherry,
I've posted the footprint of your uBGA up on my web page, I took the
image and made a *.jpg out of it instead of a *.pdf...I called the
image microBGA footprint.
Go to: http://www.stevezeva.homestead.com/
I had something similar to your problem a couple of years ago...except in my
situation there was a trace running between the two pads. So I had to
dig a little
"tunnel" beneath the trace, and connected the two pads with a piece of trace
material. This was on a uBGA as well...
Good Luck!!
-Steve Gregory-
>Steve,
>
>Hope you can help us. I don't think technet will allow attachments,
>I know I can't receive them.
>
>I attached a pdf file of the package outline data sheet for a uBGA we
>attached to a FR4 pcb. Everything worked wonderfully through our
>reflow process. Then the designer found an error in the board layout.
>E3 should have been tied to E4 (active) but wasn't, it is a dead pad
>under the component. In order to get a temporary fix, the best
>solution that we can think of is to remove the part, remove the mask
>between the two pads on the board and apply conductive epoxy.
>Purchase a micro mini-stencil (5 mil) for paste application and
>reflow/attach a new component.
>
>Still in the learning stage and would welcome suggestions, there
>hasn't been much BGA use here on-site until recently.
>
>Thank you,
>Sherry
----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
