Brad:
We recommend using aluminum tape to attach thermocouples.  It is much easier
to use than high temp solder and completely nondestructive.  There is a
paper posted on our website that discusses in depth the various means of
attaching thermocouples for profiling:  A Comparison of Methods for
Attaching TCs to PCBs for Thermal Profiling,
which can be found at www.kicthermal.com /Library.
We also offer technology that can significantly reduce your changeover times
and improve your process, which I would be glad to discuss offline.

Greg Jones Ph.D.
Special Projects Manager
775.322.0158
KIC--Innovation That Works
www.kicthermal.com


----- Original Message -----
From: "Brad A. Smith" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 25, 2001 8:37 AM
Subject: [TN] Reflow profiling


> Hello All,
>
> I am with a low volume, frequent changeover contract manufacturer. We are
> trying to implement a system where we profile the first assembly of every
> new run through our reflow oven. We are currently using high temperature
> solder for profiling. If we start to use the high temp solder for this, we
> will have to scrap the assemblies. Does anyone have any suggestions for
> alternatives to high temp solder? Any suggestions would be greatly
> appreciated.
>
> Thank you,
> Brad Smith
> Process Technician
> Badger Electronics Co., Inc.
> (262)886-8800
> [log in to unmask]
>
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