Brad,
Are you using real, fully-populated boards for thermal profiling?
Extravagant fellow is you are when the volume is low, and I'm not sure
either why you have to scrap the assemblies afterwards - the major
components willbe recoverable.
I also am involved with high mix, low volume builds, and I try to get one
board of each type from the fab house that has failed electrical with
internal shorts or whatever (cheaper than sacrificing a good board). I then
buy in a stack of dummy components from Practical Components or Topline and
populate the profile board with those. I don't bother with discrete
passives, as they contribute precious little to the thermal mass. The
thermal profile board is them reflowed using the standard profile supplied
by the solder manufacturer.
For BGA's and so forth, I then drill a hole up through the board into one
of the central contacts to take a thermocouple wire, which is bonded in
place, and add other thermocouples around the board. plug them all into a
high-temp data logger
"Brad A. Smith"
<BAS@BADGERELECTR To: [log in to unmask]
ONICS.COM> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST
Sent by: TechNet Aero/ST Group)
<[log in to unmask]> Subject: [TN] Reflow profiling
10/25/01 11:37 PM
Please respond to
"TechNet E-Mail
Forum."
Hello All,
I am with a low volume, frequent changeover contract manufacturer. We are
trying to implement a system where we profile the first assembly of every
new run through our reflow oven. We are currently using high temperature
solder for profiling. If we start to use the high temp solder for this, we
will have to scrap the assemblies. Does anyone have any suggestions for
alternatives to high temp solder? Any suggestions would be greatly
appreciated.
Thank you,
Brad Smith
Process Technician
Badger Electronics Co., Inc.
(262)886-8800
[log in to unmask]
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