Hello All,

I am with a low volume, frequent changeover contract manufacturer. We are
trying to implement a system where we profile the first assembly of every
new run through our reflow oven. We are currently using high temperature
solder for profiling. If we start to use the high temp solder for this, we
will have to scrap the assemblies. Does anyone have any suggestions for
alternatives to high temp solder? Any suggestions would be greatly
appreciated.

Thank you,
Brad Smith
Process Technician
Badger Electronics Co., Inc.
(262)886-8800
[log in to unmask]

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