Hey Ken,

You'd think x-outs would be a no-brainer but Mr. Murphy frequently visits
the shop floor.

Relocate the stamped X to the panel boarder (seems it would only work well
on low count panels - 2-up or 4-up).

Use a permanent marker sparingly (2 X's 1 - front & 1 - back.  Make sure the
ink can't wash off in any of the downstream steps and doesn't contaminate
baths (plating, developer, stripper, etc.). Photoresist pens would work but
I'm not sure they would be worth the expense.  Why operators feel the need
to completely paint a board is beyond me. <it's fun - Hans>.

I've seen small holes punched out - for x-outs and cross-sections.  This can
cause additional downstream process problems - photoresist chips in Imaging
(causing opens & shorts), broken drill bits.

If it is a two or four up I've also seen corners clipped.
Personally, I've hand stamped the frames (with x & y coordinates) but that
was for engineering stuff not production.

If the X-out is on the panel's boarder then the Route guys & gals have to be
on their toes - otherwise you'll pass bad boards to Test/Final Inspect.

Hans

Integrity First  -  Service Before Self  -  Excellence in All We Do
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Electronics Engineer
Warner Robins - Air Logistics Center (WR-ALC/LUGE)
Special Operations Forces System Program Office (SOF - SPO)
Gunship Team
226 Cochran Street
Robins AFB GA 31098-1622

mailto:[log in to unmask]

Com: (478) 926 - 5224
Fax:   (478) 926 - 4911
DSN Prefix: 468


-----Original Message-----
From: Ken Hafften [mailto:[log in to unmask]]
Sent: Thursday, October 18, 2001 9:30 AM
To: [log in to unmask]
Subject: [TN] Reject Marking


Presently we identify rejected parts on multiple up panels after lamination
by using an "X" made with a metal stamp.  This stamped "X" creates other
problems during the subsequent circuit board manufacturing process steps
such as an uneven surface for imaging.  Does anyone have another method for
marking rejects at lamination.

Thanks in advance for any assistance.

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