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October 2001

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Subject:
From:
Graham Collins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Oct 2001 11:17:04 -0400
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Moonman - when I worked for Celestica (Toronto) we only allowed 2 for any surface finish.  I worked both HASL and OSP.  I believe there was more concern with pads lifting than intermetallic layer.  Besides - if you have to replace a part 3 times you have some serious issues to work.

regards

Graham Collins
Process Engineer, 
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215

>>> [log in to unmask] 10/08/01 03:53PM >>>
For fine pitch and BGA, HP and Celestica used to allow two cycles for HASL
(ring a ding) and three for OSP and ENIG. Why is that?

MoonMan

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