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October 2001

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Subject:
From:
Bill Butman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Oct 2001 10:03:45 -0700
Content-Type:
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text/plain (158 lines)
HI  All,

I agree with Richard.

The site for the "Temprobe" is:
http://www.saunderstech.com/

Thanx
Bill Butman
--- "Elensky, Richard" <[log in to unmask]> wrote:
> Unless it is a customer requirement to provide
> thermal profiles for each
> lot, I don't  understand the necessity to profile so
> frequently.  Generally
> speaking, I have always used just a few profiles for
> everything.  These were
> defined for different pastes or epoxies.  As a new
> product came to the shop
> floor, I would run a sample with the Datapaq to
> confirm the appropriate
> thermal conditions and add that assembly to the list
> of assemblies used on
> that profile.
>
> Regarding the attachment issue, I would suggest the
> Sanders thermocouples
> that clamp onto the edge of the board (Sold by ECD
> 1-800-323-4528 or Datapaq
> 508-988-9000)  They are very accurate and require no
> attachment to the
> device (solder, glue, tape).  I had my set (8", 10",
> and 12") for several
> years and used them for both reflow and wave solder
> applications, proving
> they were quite robust.
>
> Hope this helps,
>
> Rich
>
> Richard Elensky
> Sr. Manufacturing Engineer
> [log in to unmask] <mailto:[log in to unmask]>
>
> Tel:  559-292-1111  x246
> Fax:  559-292-9355
>
> Dantel
> 2991 North Argyle Ave.
> Fresno, CA, 93727
> Visit our web site at:
> http:// www.dantel.com <http://www.dantel.com>
>
>
>         ----------
>         From:  Brad A. Smith
> [SMTP:[log in to unmask]]
>         Sent:  Thursday, October 25, 2001 8:37 AM
>         To:  [log in to unmask]
>         Subject:  [TN] Reflow profiling
>
>         Hello All,
>
>         I am with a low volume, frequent changeover
> contract manufacturer.
> We are
>         trying to implement a system where we
> profile the first assembly of
> every
>         new run through our reflow oven. We are
> currently using high
> temperature
>         solder for profiling. If we start to use the
> high temp solder for
> this, we
>         will have to scrap the assemblies. Does
> anyone have any suggestions
> for
>         alternatives to high temp solder? Any
> suggestions would be greatly
>         appreciated.
>
>         Thank you,
>         Brad Smith
>         Process Technician
>         Badger Electronics Co., Inc.
>         (262)886-8800
>         [log in to unmask]
>
>
>
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=====
Bill Butman
Circuit Technology Center
45 Research Drive
Haverhill, MA 01832

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