未讀取的主旨: RE: [TN] : "Lead Free","Great Gas out etc........" (2 Messages)
未讀取的主旨: RE: [TN] reliability testing on compliant pin technology (2 Messages)
未讀取的主旨: RE: [TN] White Residue on solder joints (2 Messages)
"Lead Free", "The Great Gas-Out", and other musings.. (3 Messages)
"Lead Free","The Great Gas-Out", and other musings.. (2 Messages)
(Fwd) Ultrasonic soldering (10 Messages)
- gerber to QUAD PNP software? (2 Messages)
32M / 64 M DIMM memory (2 Messages)
: "Lead Free","Great Gas out etc....... (5 Messages)
: "Lead Free","Great Gas out etc........" (6 Messages)
: Source for Titanium Picture Frame Pallets (12 Messages)
<No subject> (16 Messages)
??????: RE: [TN] : "Lead Free","Great Gas out etc....... ." (4 Messages)
A friend's computer (3 Messages)
A/B/C/D/E Technique in PCB manufacturing (1 Message)
Adhesive Evaluation (2 Messages)
ADMIN MESSAGE: Attention TechNet Subscribers! (2 Messages)
ADMIN-Approval Procedure Change (8 Messages)
Alternate PWB materials (6 Messages)
Alternate PWB materials [Merix site] <IPC TN> (2 Messages)
Ammoniacal Etchant Recipe (12 Messages)
ANSI/IPC-A-610 REVB (2 Messages)
Any GOOD recommendations for Career WEB sites? (10 Messages)
Anybody else having message troubles? (16 Messages)
APEXsm Call for Papers (2 Messages)
Applicon Design File Conversion to Gerber (2 Messages)
Artwork storage > Where in the world? (1 Message)
Assembly Standards (3 Messages)
assy: multiple terminations on 1 land (6 Messages)
AutoCADto PDF translator (6 Messages)
Ball Attach (2 Messages)
Bare Boards Micrographic analysis (2 Messages)
Benchtop Wave Solder (12 Messages)
BGA FAILURE ANALYSIS (8 Messages)
BGA reliability (2 Messages)
BGA Solder joint reliability (12 Messages)
BGA Soldering Specs (1 Message)
BGA soldering specs. (11 Messages)
BGA Technical & Rework Info (4 Messages)
Bi52Pb48 (2 Messages)
Black oxide process (11 Messages)
BLACK OXIDE SOLUTION (3 Messages)
Black Oxide, why bother? (1 Message)
board shearer (2 Messages)
boycott or rethink? (4 Messages)
Bright Tin Plating (1 Message)
CAD software for facilities planning (2 Messages)
CCL made from vinyl material (2 Messages)
CEM3 (1 Message)
Cleaning (1 Message)
clear plastic (16 Messages)
Compare CEM-1, CEM-3 and FR4 (8 Messages)
Component Side Test Points (2 Messages)
Computer Operator (2 Messages)
Conductive Polymer (20 Messages)
conformal coating compatability (2 Messages)
Continuous flex circuits (5 Messages)
Conveyor (3 Messages)
Conveyor again (1 Message)
copper elongation values (2 Messages)
Copper grain size (14 Messages)
COPPER-INVAR-COPPER (2 Messages)
Costing model (2 Messages)
Could we have a job for STEVE , please (12 Messages)
Covercoat and pad design for microbga (4 Messages)
Cu/Ni/Au and Press Pin (4 Messages)
Cutting and Marking of Flex Circuits (2 Messages)
Date & Time Stamping on records (8 Messages)
Defect Notification (12 Messages)
Delta Cross A properties between Beryllium and Stainless steel (1 Message)
Dielectric Calculation (4 Messages)
Different Paste Height (4 Messages)
Disappearing Solder ? (6 Messages)
Disposal of Boron charged resin columns. (1 Message)
Double Messages Double Messages (6 Messages)
Drill machine Maintenance (8 Messages)
Dry Film On Silver (2 Messages)
dummy chip for BGA (1 Message)
Dummy Components (1 Message)
Duplicate messages (2 Messages)
Electrolytic Plating (4 Messages)
Electromigration of Tin Lead #2? (2 Messages)
Electromigration of Tin Lead? (10 Messages)
ESD QUESTION (14 Messages)
ESD Table Mat Source... (1 Message)
Fab E/T Gerber comparisons (8 Messages)
FAB-Flex and Rigid Flex (2 Messages)
Fab: What if resistance is higher than 10 ohms on 100% c ontinuity test? (2 Messages)
Fab: What if resistance is higher than 10 ohms on 100% continuity test? (6 Messages)
Fine Powder Solder Paste (10 Messages)
Flex circuit - discolored copper, delam? (9 Messages)
Fractured joint clarification (2 Messages)
Gerber to PDF translator (16 Messages)
Halogen Free PCB Materials (6 Messages)
Hand Solder Pre-Heat (2 Messages)
Heavy wire Al-bonding on FR4 (1 Message)
HELP - NEED INFO ON PLATING ISSUE (6 Messages)
Help! (3 Messages)
Hermetic "plastic" (5 Messages)
Hermetic "plastic". (2 Messages)
Hermetic Plastic (2 Messages)
Hi Aspect Ratio Holes and Plating (1 Message)
Highly Qualified Rep. needed for Japan and SEA (2 Messages)
Hollow fibers (8 Messages)
Hot Airknifes (2 Messages)
Icicle formation on wave soldering (5 Messages)
In addition to duplicate notifications...... (2 Messages)
Industry Standard for solderwave preheat (1 Message)
Integrated Passive (4 Messages)
Interim Meeting Announcement ― IPC Flexible Circuits Specifications Subcommittee (2 Messages)
IPC 650 (2 Messages)
IPC Std (2 Messages)
IPC-A-610B, Solder Balls (2 Messages)
IPC-SM 840 Tape Spec (8 Messages)
J-STD-033 versus IPC-SM-786A (4 Messages)
JEDEC moisture sensitivity spec J-STD-020A (2 Messages)
Job adverts (2 Messages)
JTAG (4 Messages)
JTAG.?? (8 Messages)
Lacing Standard (1 Message)
Laminographic xray services/NE USA (6 Messages)
Lead Free and CE (2 Messages)
Lead free road map for U.S.? (6 Messages)
leads trimming (10 Messages)
Lo Behold-Voids!!!!!!!!! (2 Messages)
Looking for a silk screen software (12 Messages)
Looking for manufacturing of glass alignment plate (8 Messages)
Low cost PCB LAYOUT/SCHEMATIC SOFTWARE (6 Messages)
Low Tack Tape (12 Messages)
Low Tack Tape- a much better way to do this! (2 Messages)
Lubra Sheet (2 Messages)
M<essage probs (2 Messages)
MAC, SQA analyst (2 Messages)
Manual activities (2 Messages)
Maximum # of Reflows for TSOP's (1 Message)
MC3D material (6 Messages)
Measure Flux Concentration (3 Messages)
Melbourne-FL Jobs (2 Messages)
Monkey Trap (4 Messages)
More info - Approval Procedure Change (2 Messages)
MTG: Boston (MA, USA) area, "Stackup Design for PCBs", 03-June 6pm (2 Messages)
MTG: Greater Boston IPC Designers Council 3/19 6pm (1 Message)
MyData Pick & Place (3 Messages)
Need definition document for Gerber RS274X (6 Messages)
Needed: Sources for Ceramic boards (4 Messages)
Nitrogen in wave soldering (2 Messages)
No clean flux evaluation (2 Messages)
No scanner! (1 Message)
No Technical Content, but interesting... (2 Messages)
Nodules (1 Message)
Not read: re: Flex circuit - discolored copper, delam? (8 Messages)
Not read: RE: [TN] : "Lead Free","Great Gas out etc........" (1 Message)
Not read: [TN] : "Lead Free","Great Gas out etc........" (2 Messages)
Not read: [TN] reliability testing on compliant pin technology (2 Messages)
Order standard (1 Message)
Orlando,FL. Jobs (6 Messages)
OT RE: [TN] FW: Subject: Fwd: FW: Boycott C (2 Messages)
OT RE: [TN] FW: Subject: Fwd: FW: Boycott C [Robins AFB...] (2 Messages)
Oven Manufacturer (4 Messages)
Oven Manufaturer (2 Messages)
PBGA reliability modeling (4 Messages)
PCB assembly checking tool (2 Messages)
PCB assembly checking tool. (4 Messages)
PCB Company list (8 Messages)
PCB Layout Software (6 Messages)
PCB Manufacture in Europe (6 Messages)
PCB specs (8 Messages)
phase diagram (21 Messages)
Phase Diagram Repost (2 Messages)
Plated Through-Hole (18 Messages)
Pls condescend to give me your advice in RF layout! (4 Messages)
POTENTIOMETERS (2 Messages)
Pre-Production need (2 Messages)
Product Support/ Installation Representative (2 Messages)
ProM-S (2 Messages)
Prototype Equipment (1 Message)
Push/Pull Gages (2 Messages)
PWB baking racks (2 Messages)
re Any GOOD recommendations for Career WEB sites? <IPC TN> (2 Messages)
re Polyimide, (2 Messages)
re Polyimide, temperature for discoloration and /or pyrolosis [charring] (2 Messages)
re Polyimide, temperature for discoloration and /or pyrolysis [charring] (2 Messages)
Re; Copper Grain Size (2 Messages)
Read: re: Flex circuit - discolored copper, delam? (18 Messages)
Read: RE: [TN] reliability testing on compliant pin technology (2 Messages)
Read: RE: [TN] White Residue on solder joints (2 Messages)
Recommendations on a Versatile Microsectioning System? (1 Message)
Reflow profile (4 Messages)
reflow solder defect (1 Message)
Reflow/water resistant sticker dots (14 Messages)
register (2 Messages)
Reinforcing Materials for Probe Cards (4 Messages)
Rejected posting on Viennese Waltzes (2 Messages)
Reliability Testing (6 Messages)
reliability testing on compliant pin technology (10 Messages)
Removal of silicone oil from a PWB (8 Messages)
Replacement material forBendflex (2 Messages)
Request for Information (6 Messages)
Resist Skin Filters (8 Messages)
reuse SMCs (3 Messages)
Rework of Acrylic Conformal Coa (2 Messages)
Rework of Acrylic Conformal Coated Boards (14 Messages)
Rhodium plating source (6 Messages)
Rockwell hardness test method (4 Messages)
Room temperature oxide (6 Messages)
SBU (1 Message)
Seeking Gardner Solder Company, Chicago Ill. USA (6 Messages)
Selective Solder Machines (2 Messages)
Selective Soldering Machines. (2 Messages)
Shore hardness (6 Messages)
Silver coating on connectors (6 Messages)
Simulation of PCB ageing (8 Messages)
Simulation of PCB aging (1 Message)
Single side (type 1) boards through -hole soldering (1 Message)
SM Crystal damage (4 Messages)
SMT Components One End Raised (2 Messages)
SMT Plus Libraries for design (4 Messages)
SMT Rework Reliability (2 Messages)
Soda Strawing of solder mask on PCBs (3 Messages)
solder ball (4 Messages)
Solder balls forming on top side during wave soldering. (4 Messages)
Solder mask Removal on top of ICT test points (1 Message)
Solder reflow profile (2 Messages)
Solder Wave Pallets (7 Messages)
Solithane 113 (4 Messages)
Sorry! (4 Messages)
Spam (2 Messages)
Spam (was RE: [TN] FW: Subject: Fwd: FW: Boycott Chevron) (4 Messages)
spc charts (4 Messages)
Squeegee Blades (4 Messages)
Stencil Thickness (12 Messages)
Stencil Thickness ; polyimide EXPERIENCES ? (8 Messages)
Strength Test (2 Messages)
subcontracts (1 Message)
Subject: Fwd: FW: Boycott C (10 Messages)
Subject: Fwd: FW: Boycott Chevron (2 Messages)
Substrate questions (6 Messages)
Substrates (1 Message)
Supplier of Integrated PCB (4 Messages)
Tabletops and Workshops Featured at IPC Flex Conference (2 Messages)
Tape converters. (2 Messages)
TechNet Digest - 10 May 1999 to 11 May 1999 - Special issue (2 Messages)
TechNet Digest - 18 May 1999 - Special issue (2 Messages)
TechNet Digest - 19 May 1999 - Special issue (2 Messages)
TechNet Digest - 6 May 1999 to 7 May 1999 - Special issue (1 Message)
Temperature Curves for PCB Traces (6 Messages)
Testing labs (6 Messages)
Thanks for the info (2 Messages)
Thermal Analysis Software (1 Message)
Thermocouple Wire and Connectors (1 Message)
Thermount and teflon (8 Messages)
TI Voltage Regulator (1 Message)
Tin/Lead plating and resist Stripping (3 Messages)
Tin>Gold Versus Gold>Gold contacts? (10 Messages)
Titanium Lead Cropping Plates (1 Message)
TN: build-up microvia dielectric (2 Messages)
Tombstoning 0402 caps.... Help needed. (8 Messages)
Tombstoning of 0402's (6 Messages)
TopMark Orientation on ICs (8 Messages)
uBGA profiling (2 Messages)
UL Contact (4 Messages)
Unconnected inner-layer pads (10 Messages)
Undeletable technet message (2 Messages)
Under Stress (2 Messages)
unsubscribe (4 Messages)
Unusual PCB mounting method (2 Messages)
Use of "polished" Cu foil in multilayer PCB (2 Messages)
V-Tek Tape and Reel Machine (4 Messages)
vias as test points??? (2 Messages)
vibrating mechanism on reflow oven rail (6 Messages)
what difference is between BGA and other SMD (4 Messages)
What the hell is this stuff?? (10 Messages)
White Residue on solder joints (18 Messages)
Why ANOVA (6 Messages)
Wire Bonding On Gold (2 Messages)
X.400 Inter-Personal Notification (2 Messages)
You have been added to the TechNet list (2 Messages)
You have been removed from Technet (Delete) (8 Messages)
Your removal from the TechNet list (2 Messages)
Zinc Plating (2 Messages)
[CN] IPC News Release: IPC to Create Roadmap for Lead-FreeElectronic Assemblies (1 Message)
[CN] RO or IX? (2 Messages)
[DC] admin test; please delete (1 Message)
[DC] BGA routing equation (1 Message)
[DC] Flex Circuit (1 Message)
[DC] FREE Exhibits and Tech Sessions (1 Message)
[DC] FW: SMT Engineer (1 Message)
[DC] FW: [TN] ADMIN-Approval Procedure Change (1 Message)
[DC] Gerber to PDF translator (2 Messages)
[DC] IPC News Release: IPC to Create Roadmap for Lead-FreeElectronic Assemblies (1 Message)
[DC] MTG: Boston (MA, USA) area, "Stackup Design for PCBs", 03-June 6pm (1 Message)
[DC] perforated breakaway tabs (1 Message)
[DC] Temperature Rise for PCB Traces (1 Message)
[DC] Through-hole current calculator? (1 Message)
[Fwd: Rejected posting to [log in to unmask]] (4 Messages)
[TN] "Lead Free", "The Great Gas-Out", and other musings.. (1 Message)
[TN] Black oxide process (4 Messages)
[TN] Could we have a job for STEVE , please (2 Messages)
[TN] Electromigration of Tin Lead? (6 Messages)
[TN] Fab E/T Gerber comparisons (8 Messages)
[TN] FW: Fine Powder Solder Paste (6 Messages)
[TN] JTAG.?? (2 Messages)