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May 1999

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Subject:
Re: TopMark Orientation on ICs
From:
"Beckman, Michael W" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Beckman, Michael W" <[log in to unmask]>
Date:
Fri, 21 May 1999 08:25:16 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (73 lines) 
Tom,
You may want to trip through this site http://www.jedec.org//
I'm sure you'll find packaging requirements under the "free standards and
documents" link

Good Luck,
Mike

-----Original Message-----
From: Tomaso Mordha [mailto:[log in to unmask]]
Sent: Friday, May 21, 1999 8:01 AM
To: [log in to unmask]
Subject: [TN] TopMark Orientation on ICs


Hello Technetters,

Many thanks for the help with AutoCAD to dot.PDF conversion.

Here is another item which puzzles me ....

Is there a recognized standard for orientation of top-mark with respect to
the
pin-1 corner of the package (or ball A1 in the case of BGAs)?

What is the spec?

If it exists why do some vendors not comply with it?

Again thank you for your past help,

Tom

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