I agree with Werner- the only possible "goodness" that would come from
this is to run cycles at a high thermal gradient
(e.g., 20C/min or greater). Typical Blue M ovens that are 3X3X3 run at
7C/min maximum gradient. You would have to run at a thermal gradient so
steep that the board thermal mass becomes the limiting factor. Only then
would you find problems that are truly related to assembly and not, as
Werner has pointed out, make good product into bad product...

> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
>
>


-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Sunday, May 23, 1999 4:15 AM
To: [log in to unmask]
Subject: Re: [TN] reliability testing on compliant pin technology


Hi EG,
You did not say what you are trying to accomplish with an environmental
stress screening of -15 to 60 deg C. As ESS goes, this is not much of a
screen, and I am seriously wondering if you accomplish anything at all.
What
you do may serve as a Burn-In, but I can not imagine what latent defects
you
would screen out with -15 to 60 deg C cycling-compliant pins or not-
unless
you run it long enough to damage good product.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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