Along the lines of Dave's reply:  IPC had difficulty finding current photographs of boards with a soda
straw defect for the IPC-A-600 certification program.

Don Vischulis

Dave Hoover wrote:

> Soda Strawing....back in my day....Hehehe...meant a
> small air pocket located along the trace edge(s) under
> the soldermask (or flex covercoat). When parts were
> wet processed or fluxed with, or followed by heat,
> the corrosive chemistry(s) would wick up along the
> traces and create problems. This is more prevalent
> with overplated traces and dryfilm soldermasks.
> SIC values can be really high because the solutions
> can leach out during SIC testing. Issues like that
> could result in a latent failure of the copper
> conductors under the soldermasks (covercoats).
> With the advent of LPI Soldermask I haven't heard
> about this for a LONG....LONG time.
>
> Good Luck.
>
> Groovy
>

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