TECHNET Archives

May 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Soda Strawing of solder mask on PCBs
From:
Dave Hoover <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 May 1999 16:08:38 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines) 
Soda Strawing....back in my day....Hehehe...meant a
small air pocket located along the trace edge(s) under
the soldermask (or flex covercoat). When parts were
wet processed or fluxed with, or followed by heat,
the corrosive chemistry(s) would wick up along the
traces and create problems. This is more prevalent
with overplated traces and dryfilm soldermasks.
SIC values can be really high because the solutions
can leach out during SIC testing. Issues like that
could result in a latent failure of the copper
conductors under the soldermasks (covercoats).
With the advent of LPI Soldermask I haven't heard
about this for a LONG....LONG time.

Good Luck.

Groovy

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2