Fellow Technetters,  Does anyone have any experience with CEM -1 vs. FR-4?  What
exactly is CEM1 and it's differences to FR-4?  What reliability issues need to
be addressed?  A customer is looking for a cost savings on a high volume,
scarcely populated product.  There is only one IC on it that may need to be glob
topped or underfilled to handle the CTE of a different type of substrate.

Jason Smith
Process Materials Engineer
Lexmark Electronics

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