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May 1999

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Subject:
From:
"Lustig, Steven K.." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Lustig, Steven K.." <[log in to unmask]>
Date:
Fri, 21 May 1999 11:38:50 -0400
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text/plain
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text/plain (88 lines)
All I know is that we use an Analog Devices IC with no obvious top mark
orientation (supposedly there is a very subtle chamfer along one side - try
inspecting lots of those!).  In fact, they have a box with a triangle in it
that looks deceptively like an arrow (as if it could be pointing at pin 1)
which is just part of their text and is not pointing to the pin 1 side.

 Yes, we put them down in the wrong orientation on the prototype boards.
I've had to add a view to my assembly drawing indicating the proper
orientation of that part relative to the text to make sure we put it down
right.

A nice white dot or indentation sure would be nice!

-Steve


Steven K. Lustig
Process Engineer
EMS Technologies, Inc.
Norcross, GA
(770) 263-9200 x4714
[log in to unmask]

> ----------
> From:         Tomaso Mordha[SMTP:[log in to unmask]]
> Sent:         Friday, May 21, 1999 11:01 AM
> To:   [log in to unmask]
> Subject:      [TN] TopMark Orientation on ICs
>
> Hello Technetters,
>
> Many thanks for the help with AutoCAD to dot.PDF conversion.
>
> Here is another item which puzzles me ....
>
> Is there a recognized standard for orientation of top-mark with respect to
> the
> pin-1 corner of the package (or ball A1 in the case of BGAs)?
>
> What is the spec?
>
> If it exists why do some vendors not comply with it?
>
> Again thank you for your past help,
>
> Tom
>
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