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Subject:	Re: Simulation of PCB ageing
From:	David D Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 5 May 1999 07:54:42 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (59 lines)

Hi Vincent! The short answer to your question is "if you figure out how to
condense approximate 12 months into a conditioning method let us know" !
The JSTD-002 and JSTD-003 are actively pursuing that issue right now. The
current condition method of steam aging listed in the 002/003 standards is
only a conditioning method to differentiate poor solderability from bad
solderability - it does not approximate any true aging time. In fact,
industry data has been submitted to the committees showing that the oxides
formed in steam aging are not the same oxides formed in natural aging. The
committee is working on dry conditioning and TEM characterization of oxide
formation. Additionally the Alternative Final Finishes is working on a
figure-of-merit scale for solderable finishes with the issue of
"conditioning" being included in their efforts. As the committees
accomplish their tasks more information will be published.

Dave Hillman
Rockwell Collins
[log in to unmask]




BADA <[log in to unmask]> on 05/04/99 02:51:58 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to BADA <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] Simulation of PCB ageing




Hi

How to simulate a Pcb ageing equivalent to a one year storage ?

Is there any standard about this subject ?

Thank you,

Vincent Bada
Process Engineer
Alcatel Etca
Charleroi
Belgium

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