I would like to laminate a sheet of "adhesiveless" (sputtered) polyimide
flex material within an FR4 PCB.  The copper on the flex is very thin, just
a couple thousand angstroms, and also very very smooth.

1)  Can I connect to this thin copper with plated through holes?  What is
the minimum copper thickness for reliable PTH connection?

2)  Will "black oxide" treatment of the copper be sufficient to ensure good
lamination/adhesion of this inner layer?  Will it wipe out my 3000 Angstroms
of copper?  (if not, how are polyimide multilayers held together with good
adhesion- they just use an acrylic adhesive of some kind don't they?).  Is
there a way to "etch" the smooth copper to increase surface roughness?

3)  This flex material is one mil thick.  What percentage of PCB fabricators
out there can pattern both sides of such thin material before lamination?

Resp.
Phil Hersey, Carson City Nevada USA

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