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May 1999

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 May 1999 12:29:10 -0700
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It seems that most fabrication vendors prefer to remove the unconnected pads
from inner-layers, in fact we do it for them before we send out the gerbers.

But I thought I overheard Gary Ferrari say there was some test results that
showed the board to be more reliable with all pads included, but I don't
know where to find it or who did the testing.

Does anyone know if it is significant enough to re-evaluate our process?

Jack

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