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May 1999

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Subject:
Re: Unconnected inner-layer pads
From:
Thomas Waznis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 May 1999 18:30:59 -0700
Content-Type:
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-----Original Message-----
From: Jack Olson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, May 07, 1999 12:31 PM
Subject: [TN] Unconnected inner-layer pads


>It seems that most fabrication vendors prefer to remove the unconnected
pads
>from inner-layers, in fact we do it for them before we send out the
gerbers.
>
>But I thought I overheard Gary Ferrari say there was some test results
that
>showed the board to be more reliable with all pads included, but I
don't
>know where to find it or who did the testing.
>
>Does anyone know if it is significant enough to re-evaluate our
process?
>
>Jack
>
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If this is a concern (>8 layers, epoxy under 150Tg) leave the pads on
the first innerlayer in from both sides. This will help until you need a
higher Tg.

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